HONKON SMAS Lifting CPC 2025

Handle:

Focused Ultrasonic Manipulator
M3.0 : Impact depth - 3.0 mm (dermis and subcutaneous tissue)
M4.5 : Impact depth - 4.5 mm (SMAS fascia)


The radiofrequency attachment with depths of action of 4.5 mm, 3.0 mm and 2.0 mm supports sliding scanning mode. Its round design provides full coverage when treating the face and neck areas, and the method of accumulated heating in motion compensates for the limitations of point action, including “forbidden” zones.

Application:

Ultra-high power pulse technology:
1. The peak power of ultrasound is higher, the Vp-p voltage reaches 100V (in conventional ultrasonic scalpels it is about 48V or 24V).
2. The exposure time is shorter, the maximum pulse duration can be<50ms (with ordinary ultrasonic scalpels, 100ms).Effectively reduces the zone of thermal dissipation of ultrasonic energy in tissues, reduces thermal damage to tissues around the focal point.
3. The procedure is safer and more comfortable, and recovery after the procedure is faster.

Pulse technology:
1. Provides a pulsed ultrasound mode, which reduces pain and makes treatment more comfortable.
2. The ultrasound exposure time is shorter, the maximum pulse duration is less than 50ms, which reduces thermal damage to the tissues around the treatment area.
3. The peak power is higher, the peak pulse voltage Vp-p reaches 240V.

4. Longitudinal direction (depth of focus):
Ultrasonic energy is precisely focused at one point, concentrating the impact on the working area. This increases the effectiveness of the procedure and minimizes damage to adjacent non-therapeutic areas. Significantly reduces subcutaneous pain and shortens the recovery period.


5. Transverse direction (focal spot size):
The combination of micro-spot focusing technology and wide focal zone provides comprehensive and precise treatment.

Technical specifications: